Acer Laptop Repair Guides

Item

Specification

CPU type

Intel® Core™2 Duo T7100 Mobile Processor

Intel Core™2 Duo T7300 Mobile Processor

Intel® Core™2 Duo T7500 Mobile Processor

Intel® Core™2 Duo T7700 Mobile Processor

Clock Speeds

1.8 GHz

2.0 GHz

2.2 GHz

2.4 GHz

L2 Cache

2 MB

4 MB

4 MB

4 MB

Front Side Bus

800 MHz

Socket Interface

Socket P (PGA/BGA)

System Board Major Chips

Item

Specification

System core logic

Intel GM965 Express + Intel ICH8M chipsets

HDD controller

Intel ICH8M chipset

Memory controller

Intel GM965 Express chipset

Video controller

Intel GM965 Express chipset

Audio controller

Codec ALC268

PCMCIA controller

OZ129

LAN controller

Intel ICH8M + Broadcom 5787MKMLG chipsets

Modem controller

Intel ICH8M chipset

Bluetooth controller

Intel ICH8M chipset

Keyboard controller

Winbond WPC8768L

Item

Specification

Product

Hitachi Travelstar 5K160

Toshiba

Western Digital

Seagate

80J9

12J9

16J9

0

GSX

MK1 237 GSX

MK1 637 GSX

EVS

WD1 200B EVS

WD1 600B EVS

ST9 8081 1AS

ST9 1208 22A S

ST9 1608 21A S

Capacity (GB)

80

120

160

80

120

160

80

120

160

80

120

160

Form factor and Interface type

2.5 inch Serial ATA

Bytes per sector

512

512

N/A

512

Data heads

4

4

N/A

3

Data disks

2

2

N/A

2

Spindle speed (RPM)

5400

5400

5400

5400

Buffer size (MB)

8

8.192

8

8

Media transfer rate (Mbytes/s, max)

540

300

600

N/A

Item

Specification

Interface transfer rate (Mbytes/s, max)

150 MB/s

N/A

150 MB/s

150 MB/s

Voltage tolerance

5V(DC) +/- 5%

5V(DC) +/- 5%

5V(DC) +/- 5%

5V(DC) +/- 5%

Item

Specification

BIOS vendor

Phoenix

BIOS Version

v0.25

Supported protocols

ACPI 1.0b/2.0/3.0 compliance, PCI 2.2, System/HDD Password Security Control, INT 13h Extenstions, PnP BIOS 1.0a, SMBIOS 2.4, BIOS Boot Specification, Simple Boot Flag 1.0, Boot Block, PCI Bus Power Management Interface Specification, USB Specification 1.1/2.0, IEEE 1394 1.0, USB/1394 CD-ROM Boot Up support, PC Card Standard 1995 (PCMCIA 3.0 Compliant Device), IrDA 1.0, HD audio, WfM 2.0, Preboot Execution Environment 2.1, Boot Integrity Service Application Program Interface (BIS) 1.0, PC2002/2005 compliant, Intel Enhanced SpeedStep Technology, Intel DPST support, ASF 2.0, TPM v1.2, AHCI support, iAMT 2.5

Item

Specification

Memory controller

Intel GM965 Express chipset

DIMM socket number

2 sockets

Supports maximum memory size

2 GB for 32 bit OS, 4 GB for 64bit OS

Vendor

Samsung

Hynix

Nanya

Powerchip

Promos

Model name

M470T2953 EZ3-CE6

HYMP512S 64CP8-Y5

NT512T64U H8B0FN-3C

AS6E8E63B-6E1A

V916764B24 QBFW-F5

DIMM type

DDR2 Synchronous DRAM

DIMM speed (MHz)

667

DIMM size

1GB

1GB

512 MB

512 MB

512 MB

Item

Specification

VGA controller

Intel GM965 Express chipset with integrated 3D graphics

Features

Intel Graphic Media Accelerator (GMA) X3100 with up to 358 MB of Intel Dynamic Video Memory Technology 4.0 (8 MB of dedicated DDR2 VRAM, up to 350 MB of dynamic system memory), supporting Microsoft DirectX 9 and DirectX 10

ATI Mobility Radeon X2500 (with up to 256 MB of dedicated GDDR2 VRAM) with HyperMemory supporting Microsoft DirectX 9 and PCI Express

Item

Specification

Audio controller

Realtek ALC268 Codec

Features

Two built-in Acer 3DSonic stereo speakers, Supports high definition audio, Built-in microphone, MS-sound compatible

Item

Specification

PCMCIA controller

T17412

Card type support

Type-II

Number of slot

One

Item

Specification

LAN controller

Intel ICH8M + Broadcom 5785KMLG chipsets

LAN connector type

RJ45

Features

Onboard Gigabit Ethernet, PCI-E interface, support ASF 2.0

Item

Specification

Vendor

Intel

Model name

Wireless WiFi Link 4965AGN

PRO/Wireless 3945ABG

PRO/Wireless 3945BG

Data throughput

54 Mbps

Protocol

802.11a/b/g

802.11 a/b/g

802.11 b/g

Interface

PCI bus (mini PCI socket for wireless module)

Item

Specification

Modem controller

Intel ICH8M chipset

Vendor

Liteon

Foxconn

CastleNet

Model name

MDC-003#A8B

MDC 1.5 T60M955.00

MA820

Baud rate

56 K

Modem connector type

RJ11

Item

Specification

Bluetooth controller

Intel ICH8M chipset

Vendor

Foxconn BCM2045

Model name

T60H928.01

Protocol

Bluetooth 2.0

Connector type

Mini USB

Item

Specification

Keyboard controller

Winbond WPC8768L

Model name

Acer FineTouch keyboard

Features

5-degree curve, 88-/89- key, inverted "T" cursor layout, 2.5 mm (minimum) key travel, touchpad pointing device with 4-way scroll button or Acer BioProtect fingerprint reader supporting Acer Finger Nav 4-way control function, hotkey controls, embedded numeric keypad, multi-language support, three easy-launch buttons, three productivity keys, and two front-access communication switches

Item

Specification

Vendor

Sony

Philips BenQ

Model name

Slim Combo CRX880A

DS-24CZP

Drive type

Internal Slim CD-RW/DVD combo drive

Data transfer rate

Write:

Read:

• CD-R: 24X

• DVD-ROM: 8X

• CD-RW: 24X

• CD-ROM: 24X

Buffer Memory

2 MB

N/A

Interface

IDE

Applicable disc format

CD-R, CD-RW (Multi speed, High speed, Ultra-speed and Ultra-speed plus) CD-DA, CD-ROM (mode 1), CD-ROM XA (Mode 2, Form 1, Form 2), CD-I, CD-i Bridge, Video-CD, Karaoke CD, Photo CD, Enhanced CD, CD Plus, CD Extra, i-trax CD, CD-Text DVD-ROM, DVD-Video, DVD-Audio, SACD (Hybrid), UDF DVD, DVD-R/RW, DVD+R/RW, DVD+/-R DL, DVD-RAM V1.0/V2.1

Power supply

5 V DC

Item

Specification

Vendor

Sony

Pioneer

Philips BenQ

Panasonic

Model name

AD-7560A

DVR-K17RS

DS-8A1P

UJ-850

Drive type

Internal Slim DVD/CD writer

Data transfer rate

Write:

Write:

N/A

Write:

• CD-R: 24X

• CD-R: 24X

• CD-R: 24X

• CD-RW: 24X CAV
• DVD+RW/-RW (single layer): 8X, 6X ZCLV

• CD-RW: 24X
• DVD-RW: 6X

• CD-RW: 16X
• DVD-R: 8X

Read:

• DVD-RAM: 5X

• DVD-RW: 4X
• DVD-RAM: 5X
• DVD+R(DL): 2.4X

• DVD-R/+R (single layer): 8X CAV
• DVD-R/+R (double layer): 4X ZCLV
• DVD-RAM: 5X ZCLV

• DVD+R: 8X
• DVD+RW: 4X Read:
• CD-R/RW/ ROM: 24X
• DVD-R/RW/ ROM: 8X

Read:

• CD-R/RW/ ROM: 24X Max

• DVD-ROM (single layer): 8X CAV

• DVD-ROM (double layer): 6X CAV

• DVD-RAM: 5X ZCLV

• DVD-R/+R/ +RW/-RW (single layer): 8X CAV

• DVD-R/+R (double layer): 6X CAV

Buffer Memory

2 MB

Interface

Enhanced IDE(ATAPI) compatible

Applicable disc format

DVD-RAM, DVD-R/RW, DVD+R (SL, DL)/RW, CD-R/RW, DVD-ROM, DVDRAM, DVD-R, DVD-RW, DVD+R (SL, DL), DVD+RW; CD-R, CD-RW, CD-ROM, CD-ROM XA, CD-DA, CD-I, CD-Extra, CD-Text, Photo CD, Video CD

Power supply

5V DC

Item

Specification

Vendor

Panasonic

Sanyo

Sony

Simplo

Battery Type

Li-ion

Li-ion

Li-ion

Li-ion

Pack capacity

6 cell: 2.0 mAh

6 cell: 2.4 mAh

6 cell: 2.0 mAh

6 cell: 2.4 mAh

6 cell: 2.0 mAh

6 cell: 2.4 mAh

6 cell: 2.0 mAh

6 cell: 2.4 mAh

Item

Specification

Vendor

AUO

CMO

LG

Samsung

Model name

B141EW04-V4 (Glare)

N141I3-L02 (Glare)

LP141WX1-TLA2 (Glare)

LP141WX3-TLB1(Glare)

LTN141W3-L01-G (Glare)

Screen diagonal (mm)

14.1" WXGA

Display resolution (pixels)

1280x800

1280x800

1280x768

N/A

1280x800

Aspect ratio

16:10

N/A

15:9

N/A

N/A

Active area (mm)

303.36 x 189.6

N/A

305.8 x 183.2

N/A

303.4 x 189.6

Pixel pitch (mm)

0.237

N/A

0.2385 (107)

N/A

0.237

Mode

TN

N/A

N/A

N/A

N/A

Number of colors

262 K

262 K

262,144 (6 bit)

N/A

262 K

Color saturation (NTSC%)

45

N/A

45%

N/A

N/A

Typical white luminance (cd/ m2) also called brightness

200

220

185 (typ.5p)

200

200

Contrast ratio

400:1

300:1

500:1

N/A

500:1

Response time (optical rise time + fall time) (msec)

16

16

25

16

16

Power consumption (watt)

5.1

5.3

N/A

N/A

N/A

Supply voltage (v)

3.3

N/A

N/A

N/A

N/A

Backlight

1 CCFL

N/A

N/A

N/A

N/A

Outline dimensions (mm)

319.5 x 205.5 x 5.2

319.5 x 205 .5 x 5.2

320.0 x 199.0 x 5.5

N/A

319.5 x205.5 x 5.5

Weight (g)

400

400

400

N/A

390

Item

Specification

Vendor

YEC

Foxconn

RoHS

Model name

YNV-W06S

T621240.02

VK.21189.406

Item

Specification

Vendor

Delta

Lite-On

Model Name

ADP-9GSB BBDAF

PA-19GG-24 AR

ADP-9GSB BBEA LF

PA-19GG-G4 WR

Output rating

19 V/4.74 A, 9G W

19 V , 9GW

Input (Vac)

9G ~ 27G

1GG~24G

System Power Management

ACPI mode

Power Management

Off

• Mech. Off (G3): All devices in the system are turned off completely.
• Soft Off (G2/S5): OS initiated shutdown. All devices in the system are turned off completely.

On

• Working (G0/S0): Individual devices such as the CPU and hard disk may be power managed in this state.
• Suspend to RAM (S3): CPU set power down, VGA Suspend, PCMCIA Suspend, Audio Power Down, Hard Disk Power Down, CD-ROM Power Down, and Super I/O Low Power mode.
• Save to Disk (S4): Also called Hibernation Mode. System saves all system states and data onto the disc prior to system shutdown.