Hardware Specifications and Configurations

Processor

Item

Specification

CPU type

Intel Penryn SFF (ULV)

CPU package

Micro-FCBGA 956 balls

Chipset

• Intel Crestline GS45 SFF and ICH9M SFF

Features

  • Supports Intel architecture with Dynamic execution.
  • On-die, primary 32-kB instruction cache and 32-kB write-back data
  • cache.
  • On-die, up to 3MB second level shared cache with advanced transfer
  • cache architecture.
  • Streaming SIMD Extensions 2 (SSE2),Streaming SIMD Extensions 3
  • SSE3)
  • Supplemental streaming SIMD extensions 3 (SSSE3) and SSE4.1
  • instruction sets.
  • 800MHz source-synchronous front side bus (FSB)
  • Advanced power management features including Enhanced Intel
  • SpeedStep®
  • Technology and dynamic FSB frequency switching.
  • Digital thermal sensor (DTS).
  • Execute disable bit support for enhanced security.
  • Intel® Dynamic Acceleration Technology and Enhanced Multi
  • Threaded
  • Thermal Management (EmTTM).
  • Support enhanced Intel Virtualization Technology.
Processor Specifications

Item

CPU Speed

Cores

Mfg Tech

FSB Speed

Cache Size

Package

Power

Acer P/N

Core2Solo SUS500

1.4G

1

45nm

800 MHz

SM

BGA

5.5W

KC.S5B0 1.SSU

Celeron 72S

1.2G

TBC

45nm

800 MHz

1M

BGA

10W

KC.NB00 1.72S

Core2Duo SU4100

TBC

2

45nm

800 MHz

2M

BGA

TBC

KC.41B0 1.DSU

CPU Fan True Value Table

CPU Temperature (Celsius)

Fan Speed (RPM)

SPL Spec (dBA)

S8

2400

2S

4S

SS00

26

50

4000

29

56

4500

S1

Throttling 50%: On= 90°C; OFF=80°C OS shut down at 95°C; H/W shut down at 85°C North Bridge Specifications

Item

Specification

Chipset

Intel Crestline GS45 SFF

Package

FCBGA 1363 balls

Features

  • Processor hosts bus supports 667/800/1066MHz FSB support.
  • Supports Dual Channel DDR2 SDRAM at 667/800MHz
  • Integrated SDRAM controller up to 8GB (2 SODIMM support)
  • DMI x2 and DMI x4 for connection between GMCH and ICH9M

South Bridge Specifications

Item

Specification

Chipset

ICH9M SFF

Package

BGA 676 balls

Features

  • Upstream accelerated Hub architecture interface for access to GMCH.
  • PCI Express Base Specification, Revision 1.1 support.
  • PCI 2.3 interface. (4 PCI Request/Grant pairs).
  • ACPI Power Management Logi Support.
  • Enhanced DMA controller, interrupt controller, timers functions.
  • Integrated Serial ATA host controllers with independent DMA operation on six ports and AHCI support.
  • USB 1.1 and USB 2.0 Host controllers.
  • Supports Intel High Definition Audio (Intel HD Audio) Interface.
  • Supports Intel® Matrix Storage Technology.
  • Supports Intel® Active Management Technology.
  • Low Pin Count (LPC) interface.
  • 6 PCle ports.

System Memory

Item

Specification

Memory size

0MB (No on-board Memory)

DIMM socket number

2 sockets

Supports memory size per socket

2GB

Supports maximum memory size

4GB for 64bit OS (with two 2GB SO-DIMM)

Supports DIMM type

DDR2 Synchronous DRAM

Supports DIMM Speed

800/667 MHz

Video Specifications

Item

Specification

Chipset

Intel® GS45 Express Chipset

Package

  • 1329-ball FCBGA
  • Size: 34mm x 34mm
  • Ball pitch: 0.7mm

Item

Specification

Features

  • Microsoft Windows Vista* Premium support with the highest level of Windows Aero* experience
  • Blu-ray* logo capable HD video playback, with native support for Blu-ray* drives
  • Great 3D graphics performance
  • Intel® Clear Video Technology for excellent video quality
Hard Disk Drive Interface

Item

Specifications

Vendor &

Model

HTS545050B 9AS00

Hitachi

HTS5450S2B 9AS00

Hitachi

HTS545025B 9AS00

Hitachi

HTS545016B 9A300

Hitachi

HTS543225L

HTS54S216L9 SA00

Capacity (GB)

500

S20

250

160

250

160

Bytes per sector

512

Data heads

4

S

2

2

3

2

Drive Format

Disks

2

2

1

1

2

(RPM)

5400

Performance Specifications

Buffer size

8MB

Interface

SATA

Internal transfer rate (Gbits/ sec, max)

3GB/s maximum

1.5GB/s maximum

I/O data transfer rate

(Mbytes/ sec max)

875 Mbits/s maximum

845 Mbits/s maximum

775Mbits/s maximum

729Mbits/s maximum

DC Power Requirements

Voltage

+5.0V i 5%.

Item

Specifications

Vendor & Model Name

Seagate ST9160310AS

Seagate ST9250315AS

Seagate ST9320320AS

Seagate

ST9500325AS

Capacity (GB)

160

250

320

500

Bytes per sector

512

512

512

512

Data heads

2

2

4

4

Drive Format

Disks

1

1

2

2

Spindle speed (RPM)

5400

5400

5400

5400

Item

Specifications

Performance Specifications

Buffer size

8 MB

8 MB

8MB

8 MB

Interface

SATA

SATA

SATA

SATA

Internal transfer rate (Mbits/sec, max)

830

1175

830

1175

I/O data transfer rate

(Mbytes/sec max)

875 Mbits/s maximum

845 Mbits/s maximum

DC Power Requirements

Voltage

+5.0V ± 5%.

Item

Specifications

Vendor & Model Name

Toshiba MK1655GSX

Toshiba MK2555GSX

Toshiba MK3255GSX

Toshiba MK5055GSX

Capacity (GB)

160

250

320

500

Bytes per sector

512

512

512

512

Data heads

2

2

4

4

Drive Format

Disks

1

1

2

2

Spindle speed (RPM)

5400

Performance Specifications

Buffer size

8MB

Interface

SATA

Internal transfer rate (Mbits/sec, max)

363 ~ 952 typical

I/O data transfer rate

(Mbytes/sec max)

300

DC Power Requirements

Voltage

5V ±5%

Item

Specifications

Vendor & Model Name

Western Digital WD1600BEVT-22ZCTO

Western Digital WD2500BEVT-22ZCT0

Western Digital WD3200BEVT-22ZCT0

Western Digital WD5000BEVT-22ZAT0

Capacity (GB)

160

250

320

500

Bytes per sector

512

Data heads

2

4

3

4

Drive Format

Disks

1

2

2

2

Item

Specifications

Spindle speed (RPM)

5400

Performance Specifications

Buffer size

8 MB

Interface

SATA

Internal transfer rate (Mbits/sec, max)

N/A

I/O data transfer rate

(Mbytes/sec max)

300

DC Power Requirements

Voltage

5V ±5%

BIOS

Item

Specification

BIOS vendor

Insyde

BIOS Version

3.5

BIOS Features

  • Flash ROM 1MB
  • Support ISIPP
  • Support Acer UI
  • Support multi-boot
  • Suspend to RAM (S3) / Disk (S4)
  • Various hot-keys for system control
  • Support SMBUS 2.0, PCI2.3
  • ACPI 2.0 compliance with Intel Speed Step Support C1e, C2, C3 and S3, S4,S5 for mobile CPU.
  • DMI utility for BIOS serial number configuration/asset tag
  • Support PXE
  • Support Y2K solution
  • Support Win Flash Wake on LAN from S3
  • Wake on LAN form S4 in AC mode
  • System information
LCD 11.6"

Item

Specifications

Vendor/model name

B11.6XW02

CMO N116B6-L02

LG LP116WH1-TLA1

Samsung LTN116AT01-A01

Screen Diagonal (mm)

11.6"

11.6"

11.6"

11.6"

Display Area (mm)

256.125 x 144 (11.6" diagonal)

Display resolution (pixels)

1366x 768

1366x 768

1366x 768

1366x 768

Pixel Pitch (mm)

0.1875 x 0.1875

0.1875 x 0.1875

0.1875 x 0.1875

0.2265(H) x 0.2265(V)

Typical White Luminance (cd/m2) also called Brightness

200

200

200

200

Contrast Ratio

500:1

500:1

500:1

500:1

Response Time (Optical Rise Time/Fall Time) msec

8

7

8

8

Item

Specifications

Typical Power Consumption (watt)

4.0

4

4

2.85

Weight (without inverter)

255g

225g

255g

255g

(W)

268 x 161.5 x 5

268.0 x 161.5

268.0 x 161.5

Electrical Interface

LVDS

LVDS

LVDS

LVDS

Viewing Angle (degree) Horizontal (Right) / (Left) Vertical (Upper) / (Lower)

45/45 20/40

45/45 20/45

45/45 20/40

Bluetooth

Item

Specification

Bluetooth Controller

Bluetooth module Foxconn Bluetooth BRM 2046 BT2.1 (T60H928.33) F/ W:861

Features

  • Fully Qualified Bluetooth v2.1 with Class 2 specification RF output power.
  • Enhanced Data Rate (EDR) compliant.
  • Full Piconet and Scatternet operation.
  • Integrated PIFA Antenna with better RF performance.
  • USB 2.0 compliant interface.
  • F/W upgradable via Flash downloads.
  • Very low power consumption.
  • Support Coexistence with Intel WCS (Wireless Coexistence System) & AFH (Adaptive Frequency Hopping).
Audio Codec and Amplifier

Item

Specification

Audio Controller

Realtek ALC269X

Features

  • Headphone-out with S/PDF, Line-In and Microphone-In.
  • 2 stereo ADCs support 16/20/24-bit PCM format recording simultaneously.

LAN Interface

Item

Specification

LAN Chipset

ATHEROS AR8131L

Package

48pin QFN

Item

Specification

Features

  • The AR8131L is the third generation Gigabit Ethernet (GbE) controller solution from Atheros. It is an ultra-high performance, ultralow cost, and ultra-low power fully integrated 10/100/1000 Mbps NIC/LOM Ethernet controller perfectly suited for both PC and embedded applications.
  • The AR8131L combines a 10/100/1000BASE-T GbE media access controller (MAC), a triplespeed Ethernet physical layer transceiver (PHY), and a PCI Express bus interface.
  • The AR8131L is compliant with IEEE 802.3u specification for 10/100 Mbps Ethernet and IEEE 802.3ab specification for 1000 Mbps Ethernet.
  • The AR8131L device combines pulse shaping, Tx/Rx PCS, echo canceller, NEXT canceller, equalizer, decoder, and timing recovery functions to deliver robust signal performance in noisy environments.
  • The AR8131L GbE controller supports checksum offload features for IP, TCP, and UDP,
Keyboard

Item

Specification

Type

ACER NT1T JM11 Black

Total number of keypads

86/87/91

Windows logo key

Yes

Internal & external keyboard work simultaneously

Yes

Features

• Supports application keys for Windows XP version

Media Card Reader

Item

Specification

Chipset

Alcor AU6433

Features

  • Fully compatible with USB2.0 High Speed and backward compatible with USB1.1 specifications
  • Supports multiple flash card interfaces, including SD/ MMC/xD/MS.
  • Supports single LUN
  • 48-pin LQFP
Camera

Item

Specifications

Model No.CN0316-S30C-OV06-1

Chicony CNF9011

Type

640 x 480 VGA (0.3M) size 1/6" CMOS

640 x 480 VGA (0.3M) size 1/6" CMOS

640 x 480 VGA (0.3M) size 1/6" CMOS

Interface

USB 2.0 high speed interface

USB 2.0 high speed interface

USB 2.0 high speed interface

Optical aperture

F2.4

F2.4

F2.4 ± 5%

Focusing range

18.65~Infinite, focus on 48cm

40 cm to Infinity

17.4cm ~ Infinity, focus on 40cm

Item

Specifications

Dimensions (L x W x H mm)

65 x 8 x 3.84 +/- 0.25 (H) mm

65X 7.9X 3.8+/-0.2mm

64.8±0.3 X 7.9±0.1 X 3.64+0.15/-0.25 mm

Sensor type

CMOS (OV9710)

CMOS image sensor

CMOS

Pixel resolution

640x480

640X480

640 x 480

Pixel size

TBD

3.6um X3.6um

TBD

Image size

TBD

2.36mm(H) X1.76mm(V)

TBD

Wireless LAN

Item

Specification

Specification

Specification

Specification

Type

Atheros HB93 1x2 BGN

Intel MM#903341

Intel MM#897072

Intel MM#895373

802.11g

Radio Technology

IEEE 802.11g standard compliant

Operating Frequency

2412 ~ 2484MHz ISM band

Modulation Schemes

OFDM, DQPSK, DBPSK and CCK

Channel Numbers

  • 1—11 channels for active channels
  • 12—13 channels for passive channels

Data Rate

54Mbps with fall back rates of 48, 36, 24, 18, 12, 9 and 6Mbps

Media Access Protocol

CSMA/CA with ACK

Transmitter Output Power

Typical 13.5 dBm for 54Mbps

802.11b

Radio Technology

IEEE 802.11b Direct Sequence Spread Spectrum

Operating Frequency

2412 ~ 2484MHz ISM band

Modulation Schemes

DQPSK, DBPSK and CCK

Channel Number

  • 1—11 channels for active channels
  • 12—13 channels for passive channels

Data Rate

11Mbps with fall back rates of 5.5, 2, and 1Mbps

Media Access Protocol

CSMA/CA with ACK

Transmitter Output Power

18dBm typically

Battery

Item

Specification

6 Cell

Vendor & model name

SANYO UM-2009E Li-Ion 3S2P PANASONIC UM-2009E Li-Ion 3S2P SIMPLO UM-2009E Li-Ion 3S2P SIMPLO UM-2009E Li-Ion 3S2P

Battery Type

Li-ion

Item

Specification

6 Cell

Pack capacity

SANYO 6 cell 4400mAh SANYO 6 cell 5600mAh PANASONIC 6 cell 4400mAh PANASONIC 6 cell 5800mAh SAMSUNG 6 cell 4400mAh SAMSUNG 6 cell 5600mAh LGC 6 cell 5600mAh

Number of battery cell

6

Package configuration

3 cells in series, 2 series in parallel

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